7000 Broad Ion Beam Milling System from Nordiko

The Nordiko 7000 broad ion beam milling system is a fully automatic large area equipment. Equipped with an rf excited ion source, providing low divergence ion beams from 15 to 25 cm diameter. Interfaced to an industry standard SEMI MESC compliant wafer handling platform the system may be configured for processing various wafer sizes up to 200 mm diameter. End point detection using secondary ion mass spectroscopy (SIMS) is optionally available for precision milling applications.

The robust triode ion accelerator provides low beam divergence. Dual plasma bridge neutralisers couple electrons to the beam plasma for effective charge neutralisation at illuminated surfaces.