The ATC Ion Milling Systems are versatile tools that can be built in a wide variety of configurations. Depending on your application, these custom designed systems utilize state of the art substrate holders and ion sources. Chamber sizes vary from 10"-22" in diameter and can also include computer control, load-lock, auto-loading and a 6-position cassette with optional mask exchange.
The system is equipped with a gridded ion source positioned for uniform milling of a 200mm diameter substrate. System features a 1200 l/s turbopump, load-lock with 6-position cassette, and substrate holder with backside gas cooling and rotation. Etch rate is 320 A/min of SiO2 with +/- 2% uniformity.
These systems feature a uniquely designed milling (dry etching) platform which can accommodate samples up to 8” in diameter for a wide range of process applications, from nano pattern delineation to bulk wafer planarization. These substrate holders are designed and manufactured exclusively by AJA and offer numerous desirable features such as cooling, tilting and rotation.