EM TIC 3X is a configurable ion beam milling system that creates high-quality milling surfaces using three broad beams to help reveal true internal sample structures for downstream electron microscopy analysis. Exchangeable stages, sample holder compatibility, and stereo-microscope alignment support efficient, consistent preparation across a broad range of experiments.
Key features
- Reveal true internal structure and composition for EM analysis by creating high-quality milling surfaces with three broad beams and “pristine surface quality.”
- Simplify preparation by milling without stage rotation - three broad beams produce high-quality milling surfaces “without the need of stage rotation.”
- Hit buried targets more reliably by aligning the sample with the mask and ion guns using a stereo microscope, while observing and documenting the process.
- Improve foil and multi-layer cross-section quality with efficient preparation that supports minimal redeposition and delamination, enabling high-resolution SEM analysis (e.g., battery components).
- Reduce handling steps and keep orientation consistent across the workflow by using the same holder for EM TXP and EM TIC 3X.
- Support low-temperature preparation for heat-sensitive materials with a cooling-stage configuration.